FPC & Flex-Stife Circuit Board:
| Bestellung Quty. | Masseproduktioun | Prouf Produktioun | |
| Steif-Flex Schichten | 6 | 10 | |
| Steif-Flex Schichten | flexibelen Deel | 18 | 20 |
| Total Layer | 22 | 24 | |
| Min.Kupferdicke vun FCCL (um) | 12 | 2 | |
| Min.Dicke (mm) | Duebel Säit FPC | 0.13 | 0.11 |
| 4 Schichten Rigid-flex | 0,26 | / | |
| Linn Breet (um) | Innere Schicht (Hoz) | 65/65 | 50/60 |
| Bausseschicht (Hoz + Platting) | 75/75 | 65/75 | |
| Min.Lach (mm) | Min Mechanesch Drill | 0,1 mm | 0,05 mm ép |
| Min Laser Drill | 0,1 mm | 0,075 mm | |
| Impedanz Kontroll | ± 10% | ± 8% | |
| FPC Routing Toleranz (mm) | ± 0,1 | ± 0,05 | |
| Solder Mask | Gréng, rout, giel, blo, wäiss, schwaarz, purpur, rosa | ||
| Seidewiever Écran | Wäiss, Schwaarz, Giel | ||
| HDI | 2+C+2 | ||
| Heavy Koffer Steif- Flex | M (2oz) | ||
| Struktur | Buch, Air-Lap, Fly-tail, Onsymmetresch, Semi-flex | ||
| Material | Polyimid, FR-4, Halogenfräi, Bleifräi | ||